ZEISS Microscopy

ZEISS Crossbeam laser: A new breakthrough for FIB-SEM applications in Materials Science

August 27, 2020 | Thursday | 10.30 AM - 11.30 AM (IST)

Imaging, correlating and site specific rapid milling of materials using an integrated workflow with ZEISS Crossbeam + Fentosecond Laser

The webinar will focus on projecting the workflow of our Laser FIB in milling large volumes of material at rapid speed and also some key applications in materials research.

Laser FIB is an ideal instrument to gain rapid access to deeply buried structures. Extremely large cross-sections up to millimeters in width and depth can be prepared within minutes and a wide range of materials (hard/soft, conducting/insulating) can be machined. The FS laser creates minimal sample damage and heat affected zones. When attached to a dedicated chamber, the FIB-SEM instrument does not suffer from any contamination.
The webinar will explain a few use cases of these key features and show the desired results for materials research in rapid time.

Key features of our Femtosecond LASER :

  • Gain rapid access to deeply buried structures (50-1000µm) for FIB-SEM analysis.
  • Massive material removal (up to 15 mio. µm³/s), e.g. cross-sections up to several millimeters in width and depth.
  • Minimal damage and heat affected zones due to ultrashort laser pulses (FS laser).
  • Laser work done in a dedicated chamber to avoid contamination of the main instrument.
  • Find your hidden ROIs by correlation with previously acquired X-ray microscopy datasets.

Webinar Takeaways:

  • ZEISS Crossbeam with Femtosecond LASER – Enhances your multimodal statue of the art imaging, milling and patterning tool for Material research..
  • Our solution with a Femtosecond LASER to a ZEISS crossbeam tool enhances Large Area Removal with precise end point milling using Focused Ion Beam(Ga Ion ) coupled with parallel high resolution imaging with our Gemini Column Technology.
  • ZEISS offers a highly advanced correlative X-ray microscope with Crossbeam + Fs LASER & a multi scale environment with an opportunity to couple 3D non destructive imaging for precise targeting of deeply buried structures in a material.
  • Rapid removal of large volumes (1mm x1mm x1mm) of material in matter of minutes renders the user with a capability to correlate the region of interest for further nanoscale investigation of features that are buried deep inside the sample surface. 

Webinar Overview:

  • Speaker - Mr. Arul Maximus Rabel - Product Application Specialist, Electron Microscopy, Research Microscopy Solutions, ZEISS
  • Schedule - August 27, 2020 | 10:30 AM IST

Register for the Training

Speaker Profile:

Mr. Arul Maximus Rabel | Product Application Specialist - Electron Microscopy, Research Microscopy Solutions, ZEISS

Eight years of experience in Advanced Microscopy Techniques including Correlative Microscopy 

Areas of Specialisation:

  • Field Emission Scanning Electron Microscopy – Materials Science Application
  • Bio Sample Preparation for High Resolution SEM, TEM Imaging
  • Nanoscience and Nanotechnology, Magnetic Nanomaterial applications for Biomedical Applications 
  • Correlative Microscopy between Light and Electron Microscopes
  • Drug delivery and use of imaging in Clinical Diagnostics
  • Machine learning and AI for Microscopy