Introducing LaserFIB for ZEISS Crossbeam

Your femtosecond laser for ultrafast, large-scale material ablation

Discover the new LaserFIB for ZEISS Crossbeam, your femtosecond laser for ultrafast material processing of large samples. Fabricate samples on the scale from 10 µm to 1 mm or more. Cut deep cross-section through hard material such as SiC and expose structures of interest directly. When performing laser milling you will easily avoid contamination of your FIB-SEM as the laser is attached to a dedicated chamber which is separated from the main instrument chamber.

With the new LaserFIB for ZEISS Crossbeam, you benefit from:
  • Massive material removal: prepare extremely large cross-sections, up to millimeters in width and depth, within a few minutes (up to 15 mio. µm³/s)
  • Combining laser and FIB: Gain rapid access to deeply buried structures for focused ion beam scanning electron microscope (FIB-SEM) analysis and further FIB machining
  • Minimal damage: Thanks to ultrashort laser pulses (femtosecond laser) in a dedicated chamber, damage and heat affected zones remain minimal – without any instrument contamination

Massive Material Removal

Prepare larger samples in less time

The new LaserFIB for ZEISS Crossbeam is the ideal tool to prepare extremely large cross-sections up to millimeters in width and depth within minutes. Thanks to the ultrashort pulse duration of the femtosecond laser, LaserFIB reaches highest removal rates of up to 15 mio. µm³ per second.

These high ablation rates are ideal to prepare samples for further FIB machining with ZEISS Crossbeam, complementing LaserFIB with highest precision at an even smaller scale (100 nm – few 10 µm).

Combining Laser and FIB

Reveal all structural details

Expose regions that are hidden under the surface directly, revealing all structural details in a wide range of material types. Whether a hard or soft material, conducting or insulating material: LaserFIB machines your sample at unprecedented speed. Applications include preparation of titanium alloy pillars for micromechanical testing or cube preparation in tungsten carbide.

Before laser processing, you can correlate your FIB-SEM reference image with 3D data, e.g. X-ray microscopy data. After laser processing, return your sample to the main FIB-SEM chamber for analysis. Perform final FIB polishing to reveal even more details.

Minimal Damage

Conduct quasi-athermal ablation

Thanks to ultrashort laser pulses (femtosecond laser), LaserFIB conducts quasi-athermal ablation, reducing sample damage and heat affected zones to a minimum.

The laser work is done in a dedicated chamber to avoid contamination and to enable safe and easy sample transfer between laser chamber and the main FIB-SEM chamber.

White Paper: Rapid Sample Preparation for EBSD

Fill out the form below and download the white paper

Download the white paper and learn how to 

  • rapidly prepare cross-sections in metals without major defects or heat dissipation using LaserFIB on ZEISS Crossbeam
  • achieve a preparation quality that is suitable for direct EBSD measurement on the laser polished surface

Questions? Get in Touch with Us

Let’s talk about your research

Get in touch with us to find out more about the benefits of LaserFIB and other ZEISS microscopy solutions for your research, book a demo at our customer center, or get a quote. We are looking forward to hearing from you.